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Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously deposited on the PCB pads. The next step after component placement is soldering. There are three categories of components: active, passive and connecting. Active components, such as diodes, transistors, integrated circuits and optoelectronic devices, provide gain or directionality to electrical signals add digital processing and storage. Passive components, such as resistors and capacitors, are used to electronically "tune" a device for optimum performance. Connectors are used to provide electrical communication between electronic devices. == Placement inputs == * Flexible placer, chip shooter, and other specialized machines. * PWB with solder print. * Components supplied by feeders. * Computer files: computer program controls location of each component on the PWB (X, Y and angular theta), feeder inventory levels, placement machine vacuum holder capability, automatic component realignment, placement accuracy, vision systems, and transportation of PCBs through the lime. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Component placement」の詳細全文を読む スポンサード リンク
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